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Advantages of Megtron 6 ​​materials

Since the release of Megtron6, a multi-layer substrate material with ultra-low transmission loss in mass production by Panasonic Corporation Automotive Electronics and Electromechanical Systems in 2019, its reliable thermal stability and excellent processing performance have won wide attention and recognition. Megtron6 ​​material has the characteristics of ultra-low loss and high heat-resistant circuit boards, which are very suitable for mobile, network and wireless applications that require hig
Advantages of Megtron 6 ​​materials
26 June 2024
Views: 131
Since the release of Megtron6, a multi-layer substrate material with ultra-low transmission loss in mass production by Panasonic Corporation Automotive Electronics and Electromechanical Systems in 2019, its reliable thermal stability and excellent processing performance have won wide attention and recognition. Megtron6 ​​material has the characteristics of ultra-low loss and high heat-resistant circuit boards, which are very suitable for mobile, network and wireless applications that require high-speed and ultra-low loss circuit materials.

Advantages of Megtron 6 ​​materials

Stability: Dielectric constant (Dk): 3.7 @ 10 GHz; Dielectric loss factor (Df): 0.002 @ 10 GHz. It exhibits extremely low dielectric constant (Dk) and dielectric loss factor (Df) under high-frequency conditions, which can effectively maintain and reduce signals.

Thermal stability: High speed and high frequency require high thermal stability of materials. Several models of Megtron6 ​​products can reach a glass transition temperature (Tg) of 195°C and a decomposition temperature (Td) of 405°C.

Low thermal expansion coefficient: Z-axis thermal expansion coefficient (CTE): 40 ppm/°C (50-260°C); small dimensional changes of PCB materials when large temperature changes occur.

Conclusion

The new PCB substrate material developed by Panasonic, model megtron 6, is suitable for high-speed and high-capacity mobile, network and wireless applications. MEGTRON 6 has a low dielectric constant and has properties such as high heat resistance and low thermal expansion coefficient, which is suitable for lead-free soldering.
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