PCB Manufacturing Capabilities
Minimum Trace Width
0.10 mm (4 mil)
Minimum Trace Spacing
0.10 mm (4 mil)
Minimum Drill Size
0.15 mm (6 mil)
Maximum Board Size
18 in x 24 in (457 mm x 610 mm)
Maximum Board Thickness
0.062 in (1.6 mm) to 0.125 in (3.2 mm)
Board Material
FR-4, High-Tg FR-4, Aluminum, High Frequency, Flexible(FPC), Rigid-Flex, Rogers, Biocompatible Materials
Surface Finish
HASL, Immersion Gold, Gold Finger, OSP, Immersion Silver, ENIG, ENEPIG
Impedance Control
±10% or better
Assembly Type
Through-Hole (THT), Surface Mount (SMT), Mixed (THT+SMT)
Minimum Component Size
01005 or 0201 (Imperial) / 0402 or 0603 (Metric)
Maximum Component Size
2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm)
Component Package Types
BGA, QFN, QFP, SOIC, SOP, SSOP, TSSOP, PLCC, DIP, etc.
Minimum Pad Pitch
0.4 mm (16 mil) for QFP/QFN, 0.5 mm (20 mil) for BGA
Solder Paste Type
Leaded or Lead-Free (RoHS Compliant)
Assembly Process
Reflow Soldering, Wave Soldering, Hand Soldering, Selective Soldering
Conformal Coating
Acrylic, Silicone, Polyurethane, Epoxy, Parylene
Inspection Methods
Automated Optical Inspection (AOI), X-ray, Visual Inspection, SPI (Solder Paste Inspection)
Testing Methods
In-Circuit Test (ICT), Functional Test (FCT), Flying probe test, Boundary Scan
Design for Manufacturing (DFM)
DFM Analysis and Feedback, Design Optimization for Medical Applications
Cleanroom Capabilities
Class 10,000 (ISO 7) Assembly Available
Medical Certifications
ISO 13485:2016 (Medical Device Quality Management)
Quality Certifications
ISO 9001:2015, IPC-A-600G Class II, IPC-6012B Class II, IPC-A-610 Class III
Environmental Compliance
RoHS, REACH, UL 94V-0
Traceability
Full Component and Process Traceability for Medical Devices
Turnaround Time
Prototype: 24 hours to 7 days, Production: 10 days to 4 weeks
