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POE provides PCBA assembly, small to medium mass production volume. Our professional SMT factory has advanced equipment, such as the world-class stencil printing, SMT chip pick & place, nitrogen smt reflow oven, solder reflow, and in-line testing and steel mesh manufacturing. AOI test machine and X-ray testing machines for quality check.
Here below is our main services for PCB assembly:
Please provice BOM, so we can check and quote parts and assembly prices. Thanks.
☞ Surface Mount Technology
☞ Pin Through-hole Assembly
☞ RoHS
☞ Selective Wave Soldering
☞ Conformal Coating
☞ Complete box build
☞ Inspection Methods
Nitrogen SMT Reflow Oven
POE uses a nitrogen SMT reflow oven with 10 temperature zones.
Reflow soldering is a common process in the electronics manufacturing industry, in which the solder on electronic components and printed circuit boards is melted by high temperature heating to bond them to each other. During the soldering process, oxygen can cause oxides to form on the solder surface, affecting the quality of the solder joints and thus the reliability of the product. Nitrogen reflow soldering involves filling the reflow chamber with nitrogen to reduce oxidation on the solder surface.
The lifespan of a PCB can be increased by 30% when using a nitrogen oven.
Passing through the air furnace, there are white bubbles.
The nitrogen furnace is completely black without any bubbles.
Capacity and Delivery
The main SMT production line consists of automated high-precision state-of-the-art equipments from PanasonIC,Sumsung, Japan total 6 lines (Smallest SMT components size can reach to 01005,capable of 0.6mm*0.3mm ~ 50mm*50mmQFP, 0.15mm gap, ±0.05 accuracy ), EMS capacity can reach 150,000,000 components per month.
Our engineering team has extensive experience in DFM/DFA/DFT technologies. SMT, BGA Rework, Re-balling, X-Ray are all readily achieveable. Stencils can be cut and delivered inside of 4 hours.
Order Conditions
Standard/ Fastest Delivery Date
Prototype( <20pcs)
2 days/ 8 hours
Small Volume(20-100pcs)
3 days/ 12 hours
Medium Volume (100-1000pcs)
6 days/ 24 hours
Mass Production (>1000pcs)
Depends on BOM
What We Can Do for You?
Surface Mount Technology
POE all products follow IPC2 standards. With 18 years experience of placing BGA, UBGA, CSP and small profile passives down to and including 01005, POE offers a cost-effective high yield solution to any SMT requirement.
Pin Through Hole
Capabilities to place tape and reeled radial components sizes. Maximum PCB size is 40" x 40". Placement rates reach 15000 pieces per hour with an accuracy of 99% minimizing component loss.
RoHS Regulations
POE have 2 kinds of solutions. Lead-free and leaded soldering process. Each solution room is divided into 2 separated places, so there is no mix-up.
Selective Wave Solder
Having the Selective Wave soldering machines, POE achieves consistent quality and process control when assembling boards having multiple ground and power planes, high-current connectors or atypical distribution of components. All AOI tested before QC/IPQC.
Conformal Coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is applied onto the printed circuit board assembly to protect the electronic assembly from damage due to contamination, salt spray, moisture, fungus, dust, and corrosion caused by harsh or extreme environments.
Complete Box Build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts, plastics, casings, and print & packaging material.
Inspection Methods
AOI Testing: Checks for solder paste, components down to 01005, missing components, offset, incorrect parts, polarity. X-Ray Inspection provides high-resolution inspection of BGAs, Micro BGAs, Chip scale packages, Bare boards.
In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems.
Power-up Test
Advanced Function Test
Flash Device Programming
Functional Testing
Showcase of Previous POE Product Cases
Provide your Gerber files and Bill of Materials (BOM), and we will deliver high-quality PCBA products. We excel in both small and large-scale production, ensuring consistent excellence across all quantities. Whether it's a prototype or a full production run, our advanced facilities and skilled team are ready to handle batches of any size with precision. Our commitment to quality is reinforced by certifications such as RoHS, UL, ISO 9001, ISO 13485, and IPC standard, guaranteeing that every assembly meets the highest industry standards.
Comprehensive testing applied throughout new product development saves customers money while reducing manufacturing downtime. At the earliest stages, in-circuit testing, automated optical inspection (AOI), and Agilent 5DX inspection provide vital feedback that facilitates timely adjustments. Then functional and application testing are performed to individual customer specifications before rigorous environmental stress screening verifies product reliability. When it comes to introducing a new product, POE's suite of functional and testing capabilities ensures that we build it right the first time, delivering a solution that exceeds expectations.
Functional Testing
Functional testing simulates the operating environment for the product under test, minimizing the expensive cost for the customer to provide the actual testing equipment. It eliminates the need for expensive system tests in some cases, which saves the OEM lots of time and financial resources.
It can check the functionality of the product anywhere from 50% to 100% of the product being shipped, thereby minimizing the time and effort on the OEM to check and debug it. Prudent testing engineers can extract the most productivity out of functional tests, making it the most effective tool short of a system test.
Functional tests enhance other types of tests such as ICT and flying probe tests, making the product more robust and error-free.
Flying Head Probe / Fixture-less Test
AXI – 2D and 3D automated X-ray inspection; AOI – automated optical inspection; ICT – in-circuit test; ESS – environmental stress screening; EVT – environmental verification testing; FT – functional and system test; CTO – configure-to-order, diagnostic and failure analysis, PCBA manufacturing & testing.
Our PCBA-based product manufacturing handles a wide range of assemblies, from single PCB assemblies to PCBAs integrated into box-build enclosures.
ICT Performs Comprehensive Testing
In-circuit testing (ICT) is traditionally used on mature products, especially in subcontract manufacturing. It uses a bed-of-nails test fixture to access multiple test points on the PCB's bottom side. With sufficient access points, ICT can transmit test signals into and out of PCBs at high speed to perform evaluation of components and circuits.
A bed of nails tester is a traditional electronic test fixture with numerous pins inserted into holes, making contact with test points on a printed circuit board.
Benefits of ICT
Although a costly fixture is required, ICT covers 100% testing so that all power and ground shorts are detected.
ICT testing does power up testing and eliminates customer debug needs to almost ZERO.
ICT does not take a very long time to perform, for example if flying probe takes 20 minutes or so, ICT for the same time might take a minute or so.
Checks and detects shorts, opens, missing components, wrong value components, wrong polarities, defective components and current leakages in the circuitry.
Highly reliable and comprehensive test catching all manufacturing defects, design faults, and flaws. Testing platform is available in Windows as well as UNIX, thus making it slightly universal for most testing needs.
Test development interface and operating environment is based on standards for an open system with fast integration into an OEM customer’s existing processes.
ICT is the most tedious, cumbersome, and expensive type of testing. However, ICT is ideal for mature products requiring volume production. It runs the power signal to check voltage levels and resistance measurements at different nodes of the board. ICT is excellent at detecting parametric failures, design related faults and component failures.
Delivery worldwide by air or by sea quickest 2days (DDP,EXW,CIF,FOB).
Feedback from Customers, Order complete.
*If you need bare PCB manufacturing + component assembly, then you need to provide gerber file and BOM.
A: Your files are held in complete safety and security. We protect the intellectual property for our customers in the whole process. All documents from customers are never shared with any third parties. We are willing to sign NDA effect by customer side local law and promising to keep customers data in high confidential level.
A: Yes.
A: Yes, we are open and transparent on each production process. We Welcome you visit our factory to inspect our production process.
A: Yes, for any quality problems will take our responsibility to solve it for you any time.
A: Visa, Mastercard, T/T (Telegraphic Transfer), PayPal, PayPal BNPL (Buy Now, Pay Later), Apple Pay, Google Pay, Pix, OXXO, Billie, GC Real-Time Bank Transfer, Payoneer, Western Union, BEA (Bank of East Asia), East West Bank, Bank of China
A: Yes, that's not a problem. However, we offer PCB manufacturing, component procurement, and PCB assembly in a continuous and smooth manner to save our customers' time and money.
Contact us
POE can quickly provide you with PCB prototype/ small and medium-volume PCB/ PCBA manufacturing. Send your PCB files or BOM list to us and you will get a quote as soon as possible!
