Layer count | 4 - 40+ layers, with various HDI structures such as 1+N+1, 2+N+2, 3+N+3, and ELIC (Every Layer Interconnect) |
Base Material | FR-4, High Tg FR-4, Halogen-free, Rogers, or other high-performance materials |
Board Thickness | 0.2mm - 6.0mm |
Copper Thickness | 0.5 oz - 6 oz (17.5μm - 210μm) |
Minimum Hole Size | 0.1mm for mechanically drilled microvias, 0.075mm for laser-drilled microvias |
Minimum Trace/Space Width | 2 mils (50μm) for standard HDI, down to 1 mil (25μm) for advanced designs |
Solder Mask | LPI (Liquid Photo-Imageable) in Green, Yellow, White, Black, Blue, Red, and other custom colors |
Silkscreen | White, Black, Yellow, and other custom colors |
Surface Finishes | ENIG, OSP, Immersion Silver, Immersion Tin, HASL |
Blind/Buried Vias | Yes, to enable routing between adjacent or non-adjacent layers |
Minimum Annular Ring | 2 mils (50μm) for outer layers, 1 mil (25μm) for inner layers |
Controlled Impedance | Tolerance of ±10% or better |
Special Features | mbedded or integrated passive components (resistors, capacitors, etc.), rigid-flex designs, back drilling, etc. |
*If you need bare PCB manufacturing + component assembly, then you need to provide gerber file and bom.
Email: all@poe-pcba.com