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List of common defects in PCB lamination

Various defects often occur in the PCB manufacturing process. This article will list the common problems in the PCB lamination process to help understand the defects that may occur in the lamination process.
List of common defects in PCB lamination
24 June 2024
Views: 133
Various defects often occur in the PCB manufacturing process. This article will list the common problems in the PCB lamination process to help understand the defects that may occur in the lamination process.

Problem description: There are white spots on the substrate
Acceptance Criteria: White spots on the substrate are acceptable for all products except those used in high pressure areas.
Problem description:The steel plate was not cleaned properly when pressing the plate or the sliding plate caused dents.
Acceptance Criteria: 
1. If the line position exceeds the repair criteria, it must be scrapped;
2. The defect length on the large copper surface is <7mm and each unit does not exceed one line.
Problem description:The copper foil is poorly bonded to the prepreg, resulting in delamination and blistering.
Acceptance Criteria: 
1. The area affected by the defect does not exceed 1% of the area of ​​each side of the board;
2. The defect does not reduce the spacing between conductive patterns to below the specified minimum spacing requirement;
3. The blistering or delamination span is not greater than 25% of the distance between adjacent conductive patterns;
4. The simulated thermal test is not expanded.
Problem description:The steel plate was not cleaned properly or was uneven when pressing the plate, causing dents.
Acceptance Criteria: 1. If the line position exceeds the repair criteria, it must be scrapped; 2. If the defect length on the large copper surface is less than 7mm and each unit does not exceed one, it is acceptable.
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